Avery Dennison partners with Dutch firm for long-range tracker
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Westborough’s Avery Dennison has announced the production of a larger RFID chip that will improve production capacity while also boosting the range for the product that is used to digitally tag shipments and retail items.
The new Radio Frequency Identification (RFID) chip will be manufactured in partnership with NXP Semiconductors N.V. The new RFID wafer represents an industry-first 12-inch wide wafer, according to a release from Avery Dennison, that outperforms the industry-standard 8-inch wafer for range.
However, the new product will also reduce waste, according to the release, as a larger wafer diameter allows more devices to be produced from a single wafer, thus reducing manufacturing expense as well. The chips can also be incorporated into Avery Dennison’s SmartFaceTechnology, which removes the plastic material in RFID products and replaces it with a paper substrate to reduce environmental impact, according to the company.
Avery Dennison focuses on labeling and packaging materials and solutions, with operations in more than 50 countries and more than 25,000 employees worldwide.
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