December 15, 2008
Rohm And Haas, IBM Ink Semiconductor Deal
By Matthew L. Brown
Marlborough's Rohm and Haas Electronic Materials has entered a joint development agreement with computer giant IBM.
Under the agreement, Rohm and Haas will develop and evaluate new materials for semiconductor packaging. The two companies have a longstanding working relationship. Work on the new project will be done at IBM's T.J. Watson Research Center in Yorktown Heights, N.Y., and at Rohm and Haas' technology center in Marlborough.
Rohm and Haas is based in Philadelphia.
According to the companies, new semiconductor systems require complex packaging schemes and new materials that present technical challenges to manufacturers.
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